Display device

ABSTRACT

A display device includes a substrate, a plurality of pixels above the substrate, each of the pixels including a light emitting element, a display region including the plurality of pixels, a thin film transistor which each of the plurality of pixels includes, a protective film including a first inorganic insulating material and located between the thin film transistor and the light emitting element, a sealing film including a second inorganic insulating material and covering the light emitting element, and at least one through hole located in the display region and passing through the substrate, the protective film, and the sealing film, wherein the second inorganic insulating material is in direct contact with the protective film in a first region located between the through hole and the pixels.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2016-230245, filed on Nov. 28,2016, the entire contents of which are incorporated herein by reference.

FIELD

An embodiment of the present invention is related to a structure of adisplay region in a display device.

BACKGROUND

Conventionally, an organic EL display device (OrganicElectroluminescence Display) using an organic electroluminescencematerial (organic EL material) in a light emitting element (organic ELelement) of a display part is known as a display device. Unlike a liquidcrystal display device or the like, an organic EL display device is aso-called self-light emitting type display device that realizes displayby causing an organic EL material to emit light.

In recent years, in this type of organic EL display device, a displaywith various shapes having through-holes in a display region has beendeveloped. For example, an organic EL display device has been disclosedin which a through hole passing through a display region is arranged ina display panel as a vehicle display meter (for example, Japanese PatentLaid-Open Publication No. 2014-235790).

SUMMARY

A display device in an embodiment according to the present inventionincludes a substrate, a plurality of pixels above the substrate, each ofthe pixels including a light emitting element, a display regionincluding the plurality of pixels, a thin film transistor which each ofthe plurality of pixels includes, a protective film including a firstinorganic insulating material and located between the thin filmtransistor and the light emitting element, a sealing film including asecond inorganic insulating material and covering the light emittingelement, and at least one through hole located in the display region andpassing through the substrate, the protective film, and the sealingfilm, wherein the second inorganic insulating material is in directcontact with the protective film in a first region located between thethrough hole and the pixels.

A display device in an embodiment according to the present inventionincludes a substrate, a plurality of pixels above the substrate, each ofthe pixels including a light emitting element, a display regionincluding the plurality of pixels. a sealing film covering the lightemitting element and including a first inorganic insulating layer, anorganic insulating layer, and a second inorganic insulating layer, and athrough hole located in the display region and passing through thesubstrate and the sealing film, wherein the light emitting element, thefirst inorganic insulating layer, the organic insulating layer, and thesecond inorganic insulating layer are stacked in this order, and thefirst inorganic insulating film is in direct contact with the secondinorganic insulating film in a first region located the through hole andthe pixels.

A display device in an embodiment according to the present inventionincludes a display panel having a substrate and a display regionincluding a plurality of pixels, and a through hole located in thedisplay region and passing through the display panel, wherein a regionwhere an organic insulating film does not locate above the substrate islocated between the through hole and the pixels.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic view showing a structure of a display devicerelated to one embodiment of the present invention;

FIG. 2 is a cross-sectional view taken along the line A1-A2 in FIG. 1;

FIG. 3 is a diagram showing a display region of a display device relatedto one embodiment of the present invention;

FIG. 4 is a cross-sectional view showing a structure of a display devicerelated to one embodiment of the present invention;

FIG. 5 is a cross-sectional view showing a structure of a display devicerelated to one embodiment of the present invention;

FIG. 6 is a cross-sectional view showing a structure of a display devicerelated to one embodiment of the present invention;

FIG. 7 is a cross-sectional view showing a structure of a display devicerelated to one embodiment of the present invention;

FIG. 8 is a diagram for explaining a manufacturing process of a displaydevice related to one embodiment of the present invention;

FIG. 9 is a diagram for explaining a manufacturing process of a displaydevice related to one embodiment of the present invention;

FIG. 10 is a cross-sectional view showing a structure of a displaydevice related to one embodiment of the present invention;

FIG. 11 is a cross-sectional view showing a structure of a displaydevice related to one embodiment of the present invention;

FIG. 12 is a cross-sectional view showing a structure of a displaydevice related to one embodiment of the present invention;

FIG. 13 is a cross-sectional view showing a structure of a displaydevice related to one embodiment of the present invention;

FIG. 14 is a cross-sectional view showing a structure of a displaydevice related to one embodiment of the present invention;

FIG. 15 is a diagram for explaining a manufacturing process of a displaydevice related to one embodiment of the present invention;

FIG. 16 is a diagram for explaining a manufacturing process of a displaydevice related to one embodiment of the present invention;

FIG. 17 is a diagram showing an example of a structure of a displayregion in a display device;

FIG. 18 is a diagram showing an example of a structure of a displayregion in a display device;

FIG. 19 is a diagram showing an example of a structure of a displayregion in a display device; and

FIG. 20 is a diagram showing an example of a structure of a displayregion in a display device.

DESCRIPTION OF EMBODIMENTS

Each embodiment of the present invention is explained below whilereferring to the diagrams. However, it is possible to perform thepresent invention using many different forms within a scope that doesnot depart from the intention of the invention and the present inventionshould not be limited to the content described in the embodimentsexemplified herein. In addition, although the width, thickness and shapeof each component are shown schematically compared to their actual formin order to better clarify explanation, the drawings are merely anexample and should not limit an interpretation of the present invention.Furthermore, in the specification and each drawing, the same referencesymbols are attached to similar elements and elements that have beenmentioned in previous drawings, and therefore a detailed explanation maybe omitted where appropriate.

In the present invention, when a plurality of films is formed byprocessing one film, the plurality of films may have functions or rolesdifferent from each other. However, the plurality of films originatesfrom a film formed as the same layer in the same process and has thesame layer structure and the same material. Therefore, the plurality offilms is defined as films existing in the same layer.

Furthermore, in the present specification, expressions such as “above”,“below” when explaining the diagrams express a relative relationshipbetween a structure focused on and other structures. In the presentspecification, a direction from a first substrate towards a pixelelectrode in a side surface view is defined as “above” and the reversedirection is defined as [below]. In the present specification and scopeof the patent claims, when expressing a form in which a certainstructure is arranged above another certain structure, as long as thereis no particular limitation, these include parts which are not onlydirectly above other parts or regions but also in an upper direction.That is, in the case where certain parts or regions are given as [above]other parts or regions, other structural elements may be includedbetween other parts or regions in an upper direction.

First Embodiment

FIG. 1 is a schematic view showing a structure of a display device 100according to one embodiment of the present invention, and shows aschematic structure in the case when the display device 100 is seen in aplanar view. In the present specification, a state of the display device100 when viewed from a direction perpendicular to a screen (displayregion) is referred to as “planar view”.

As shown in FIG. 1, the display device 100 includes a display region103, a scanning line drive circuit 104, a data line drive circuit 105and a driver IC 106 formed above a first substrate 101. The driver IC106 functions as a control part which provides signals to the scanningline driving circuit 104 and the data line driving circuit 105. The dataline driving circuit 105 may be incorporated within the driver IC 106.The driver IC 106 may be arranged above the first substrate 101 in theform of an IC chip, or may be arranged on a flexible printed circuit(FPC) 108. The flexible printed circuit 108 is connected to a terminal107 arranged above the first substrate 101. In addition, a countersubstrate 102 described later is arranged facing the first substrate101. Furthermore, the first substrate 101 and constituent elements whichare deposited or bonded on a main surface of the first substrate 101 arecollectively referred to as a display panel.

Here, the first substrate 101 is formed from an insulating material andsupports each layer such as a pixel electrode and an insulating layerarranged on a surface of the first substrate 101. Furthermore, aninsulating film (underlayer film) may be formed directly in contact withthe surface of the first substrate 101. The material of the firstsubstrate 101 and the material forming the insulating film are notparticularly limited.

The display region 103 shown in FIG. 1, a plurality of pixels 109 arearranged in a matrix. Each of the pixels 109 includes a light-emittingelement constituted a pixel electrode (anode), an organic layer(light-emitting section) including a light-emitting layer stacked on thepixel electrode, and a counter electrode (cathode). A data signalcorresponding to image data is provided to each pixel 109 from the dataline driving circuit 105. According to these data signals, a transistorelectrically connected to a pixel electrode arranged in each pixel 109is driven and it is possible to perform a screen display according tothe image data. Typically, a thin film transistor (TFT) can be used asthe transistor. However, the transistor is not limited to a thin filmtransistor and any element may be used as long as it has a currentcontrol function.

FIG. 2 is a diagram showing an example of a pixel structure in thedisplay device 100 according to the first embodiment. Specifically, FIG.2 shows a structure is shown of a cross section corresponding to A1-A2of the display region 103 shown in FIG. 1. FIG. 2 shows a cross sectionof three light emitting elements 130 as a part of the display region103. Although three light emitting elements 130 are exemplified in FIG.2, actually, in the display region 103, several million or more lightemitting elements are arranged in a matrix corresponding to the pixels.

As shown in FIG. 2, the display device 100 includes a first substrate101, a second substrate 112, and a counter substrate 102. A glasssubstrate, a quartz substrate, a flexible substrate (polyimide,polyethylene terephthalate, polyethylene naphthalate, other flexibleresin substrate) can be used as the first substrate 101, the secondsubstrate 112 and the counter substrate 102. In the case when it is notnecessary for the first substrate 101, the second substrate 112 and thecounter substrate 102 to have translucency, it is also possible to use ametal substrate, a ceramic substrate and a semiconductor substrate. Inthe present embodiment, an example will be explained in which thematerial of the first substrate 101 is polyimide and the material pf thesecond substrate 112 and the counter substrate 102 are polyethyleneterephthalate. Since the second substrate 112 is arranged provided onthe rear surface of the first substrate 101 (surface on the oppositeside to the side on which the terminal 107 is located), the secondsubstrate 112 is also called a protective film or a protective resinfilm.

An underlayer film 113 is arranged above the first substrate 101. Theunderlayer film 113 is an insulating layer formed from an inorganicmaterial such as silicon oxide, silicon nitride and aluminum oxide orthe like. The underlayer film 113 is not limited to a single layer andmay have a stacked structure in which, a silicon oxide layer and asilicon nitride layer are combined for example. The underlayer film 113may be appropriately determined considering adhesion to the firstsubstrate 101, and gas barrier properties with respect to the transistor120 described later.

A transistor 120 is arranged above the underlayer film 113. Thestructure of the transistor 120 may be a top gate type or a bottom gatetype structure. In the present embodiment, the transistor 120 includes asemiconductor layer 114 arranged above the underlayer film 113, a gateinsulating film 115 covering the semiconductor layer 114, and a gateelectrode 116 arranged above the gate insulating film 115. In addition,an interlayer insulating film 122 is arranged above the gate electrode116. A source electrode or drain electrode 117 and a source electrode ordrain electrode 118 is arranged above the interlayer insulating film122. A source electrode or drain electrode 117 and a source electrode ordrain electrode 118 is electrically connected to the transistor 120.Furthermore, in the present embodiment, although the interlayerinsulating film 122 is explained as having a single layer structure asan example, the interlayer insulating film 122 may also have a stackedstructure.

The material of each layer forming the transistor 120 may be any knownmaterial and is not particularly limited. For example, generally,polysilicon, amorphous silicon, or an oxide semiconductor can be used asthe semiconductor layer 114. Silicon oxide or silicon nitride can beused as the gate insulating film 115. The gate electrode 116 is formedfrom a metal material such as copper, molybdenum, tantalum, tungsten oraluminum. Silicon oxide or silicon nitride can be used as the interlayerinsulating film 122. The source electrode or drain electrode 117 and thesource electrode or drain electrode 118 are each made of a metalmaterial such as copper, titanium, molybdenum or aluminum.

Although not shown in FIG. 2, it is possible to arrange a first wiringformed from the same metal material as the metal material forming thegate electrode 116 in the same layer as the gate electrode 116. Thefirst wiring can be arranged as, for example, a scanning line driven bythe scanning line driving circuit 104 or the like. In addition, althoughnot shown in FIG. 2, it is possible to arrange a second wiring extendingin a direction intersecting the first wiring in the same layer as thesource electrode or drain electrode 117 and the source electrode ordrain electrode 118. For example, the wiring can be arranged as a dataline or the like driven by the data line driving circuit 105.

A planarization film 123 is arranged above the transistor 120. Theplanarization film 123 is formed including an organic resin material.For example, a known organic resin material such as polyimide,polyamide, acrylic or epoxy and the like can be used as the organicresin material. These materials are capable of forming a film by asolution coating method and have a feature of highly flattening effects.Although not specifically shown in the diagram, the planarization film123 is not limited to a single layer structure and may also have astacked structure of a layer containing organic resin materials andinorganic insulating layers.

The planarization film 123 includes a contact hole which exposes a partof the source electrode or drain electrode 118. The contact hole is anopening part for electrically connecting a pixel electrode 125 describedlater and the source electrode or drain electrode 118. Therefore, thecontact hole is arranged overlapping a part of the source electrode orthe drain electrode 118. The source electrode or drain electrode 118 isexposed at the bottom surface of the contact hole.

A protective film 124 is arranged above the planarization film 123. Aprotection film 124 includes a contact hole overlapping the contact holeformed in the planarization layer 123 and exposing a part of the sourceelectrode or drain electrode 118 in the contact hole. The protectivefilm 124 is preferably an inorganic insulating material or a materialhaving barrier properties against a moisture or oxygen, and is formedusing a silicon nitride film for example.

A pixel electrode 125 is arranged above the protective film 124. Thepixel electrode 125 overlaps the contact hole of the planarization film123 and the protection film 124 and is electrically connected to thesource electrode or drain electrode 118 exposed at the bottom surface ofthe contact hole. In the display device 100 of the present embodiment,the pixel electrode 125 functions as an anode which forms a lightemitting element 130. The pixel electrode 125 has a different structuredepending on whether it is a top emission type or a bottom emissiontype. For example, in the case of the top emission type structure, ametal film (for example, silver) having a high reflectance is used asthe pixel electrode 125, or a stacked structure of a transparentconductive film with a high work function such as an indium oxide typetransparent conductive film (for example, ITO) or a zinc oxide typetransparent conductive film (for example, IZO, ZnO) and a metal film isused. In the case of a bottom emission type structure, the transparentconductive film described above is used as the pixel electrode 125. Inthe present embodiment, a top emission type organic EL display device isexplained as an example. An end part of the pixel electrode 125 iscovered by a first insulating layer 126 described later.

For example, a first insulating layer 126 formed from an organic resinmaterial is arranged above the pixel electrode 125. A known resinmaterial such as polyimide, polyamide, acrylic, epoxy or siloxane can beused as the organic resin material. The first insulating layer 126 hasan opening part in a part of the pixel electrode 125. The firstinsulating layer 126 is arranged to cover an end part (edge part) of thepixel electrode 125 between mutually adjacent pixel electrodes 125, andfunctions as a member that divides adjacent pixel electrodes 125. Thatis, the first insulating layer 126 is divided into a plurality of pixels109. As a result, the first insulating layer 126 is also generallycalled a “partition wall” or a “bank”. A part of the pixel electrode 125exposed from the first insulating layer 126 serves as a light emittingregion of the light emitting element 130. It is preferred that an innerwall of the opening part of the first insulating layer 126 has a taperedshape. This makes it possible to reduce coverage defects at an end partof the pixel electrode 125 when forming a light emitting layer describedlater. The first insulating layer 126 may not only cover the end part ofthe pixel electrode 125 but may also function as a filling materialfilling a concave part caused by the contact hole of the planarizationfilm 123 and the protective film 124.

An organic layer 127 is arranged above the pixel electrode 125. Theorganic layer 127 has at least a light emitting layer formed from anorganic material and functions as a light emitting part of the lightemitting element 130. In addition to the light emitting layer, theorganic layer 127 may include various layers such as an electroninjection layer, an electron transport layer, a hole injection layer anda hole transport layer. The organic layer 127 is arranged to cover thelight emitting region, that is, to cover an opening part of the firstinsulating layer 126 in a light emitting region.

Furthermore, in the present embodiment, by arranging a light emittinglayer which emits light of a desired color in the organic layer 127 andforming the organic layer 127 having different light emitting layersabove each pixel electrode 125, it is possible to display each color ofRGB. That is, in the present embodiment, the organic layer 127 isdiscontinuous between adjacent pixels 109, in other words, betweenadjacent pixel electrodes 125. A known structure or a known material canbe used for the organic layer 127, and is not particularly limited tothe structure of the present embodiment. In addition, the organic layer127 has a light emitting layer that emits white light, and each color ofRGB may be displayed through a color filter. In this case, the organiclayer 127 may be arranged to cover the first insulating layer 126 andacross a plurality of pixels 109.

A counter electrode 128 is arranged above the organic layer 127 and thefirst insulating layer 126. The counter electrode 128 functions as acathode which forms the light emitting element 130. Since the displaydevice 100 of the present embodiment is a top emission type, atransparent electrode is used as the counter electrode 128. An MgAg thinfilm or a transparent conductive film (ITO or IZO) is used as the thinfilm forming the transparent electrode. The counter electrode 128 isalso arranged above the first insulating layer 126 and across each pixel109. The counter electrode 128 is electrically connected to an externalterminal via a conductive layer on a lower layer on the outer side ofthe display region 103 and in a periphery region in the vicinity of anend of the display region 103. As described above, in the presentembodiment, the light emitting element 130 is formed by a part (anode)of the pixel electrode 125, the organic layer 127 (light emitting part)and the counter electrode 128 (cathode) exposed from the firstinsulating layer 126.

A first inorganic insulating layer 131 is arranged above the counterelectrode 128. The first inorganic insulating layer 131 covers aplurality of light emitting elements 130 and protects the light emittingelement 130 from external moisture and external air and the like.Therefore, the first inorganic insulating layer 131 is also called asealing film. It is preferred to use an inorganic insulating film havinghighly density such as a silicon nitride film as the first inorganicinsulating layer 131. Furthermore, the sealing film may have a stackedstructure of an inorganic insulating film and an organic insulatingfilm. As is described later, a three-layer structure is possible inwhich an organic insulating film is arranged above the first inorganicinsulating layer 131 and an inorganic insulating film is furtherarranged above the organic insulating film.

From the second substrate 112 to the first inorganic insulating layer131 (sealing film) explained above are collectively referred to as anarray substrate in the present embodiment.

The counter substrate 102 is arranged via a filler 135 (also referred toas a filler material) functioning as an adhesive and a protectivematerial above the array substrate. A known resin material of polyimidetype, polyamide type, acrylic type, epoxy type or siloxane type can beused as the filler 135. In particular, in the case when the countersubstrate 102 is a resin substrate (resin film), a known adhesive havingtranslucency is used for the filler 135. A spacer may also be arrangedin the filler 135 in order to secure a gap between the array substrateand the counter substrate 102. Such a spacer may be mixed with thefiller 135 or may be formed using a resin or the like above the arraysubstrate. In addition, a structure which does not use the filler 135 isalso possible as long as it is possible to realize sufficient sealing ata periphery part of the substrate between the array substrate and thecounter substrate 102, bonding between the array substrate and thecounter substrate 102, and gap retention. In a structure which does notuse the filler 135, an annular substrate bonding member (also called asealing material) may be arranged at the substrate periphery partbetween the array substrate and the counter substrate 102. For example,an organic resin or frit glass is used as the substrate bonding member.In addition, in a structure which does not use the filler 135, an inertgas (for example, nitrogen) may be filled into sections where the filler135 is located in FIG. 2.

For example, an overcoat layer may be arranged on the counter substrate102 for flattening. In the case when the organic layer 127 emits whitelight, a color filter corresponding to each color of RGB and a blackmatrix between color filters may be arranged on a main surface (surfacefacing the first substrate 101) of the counter substrate 102. Thecounter substrate 102 is not an essential element of the display device100, the filler 135 has sufficient film thickness and strength so thatif it is possible to suitably protect a layer below the sealing filmfrom contact with external foreign matter or the like, then the countersubstrate 102 can be omitted. In the case when the counter substrate 102is omitted and a color filter is necessary, for example, a color filtermay be directly formed on a sealing film or the like and the filler 135may be formed thereon. In addition, a polarization plate 138 is arrangedon a rear surface (display surface side) of the counter substrate 102.The polarization plate 138 is a circularly polarization plate forexample. The counter substrate 102 may be omitted and a circularlypolarization plate may be attached to the array substrate via anadhesive. In other words, the counter substrate 102 may be a circularlypolarization plate.

A structure in which a through hole 110 passing through the arraysubstrate and the counter substrate 102 arranged in the display region103 of the display device 100 is shown in FIG. 3. A plurality of pixels109, a through hole 110 and a moisture blocking region 111 are shown inFIG. 3.

As shown in FIG. 3, the display region 103 includes a plurality ofpixels 109, a plurality of scanning lines 141, a plurality of data lines142, a through hole 110 and a moisture blocking region 111 (also calleda region surrounding the through hole 110). The scanning line 141 iselectrically connected to a pixel circuit arranged in a pixel 109. Thedata line 142 intersects the scanning line 141 and is electricallyconnected to a pixel circuit arranged in a pixel 109.

In addition, as shown in FIG. 3, the scanning line 141 bypasses thethrough hole 110 and the moisture blocking region 111 and is connectedto a pixel circuit arranged in each of the pixels 109 on both sidesfacing the through hole 110. In addition, the data line 142 alsobypasses the through hole 110 and the moisture blocking region 111 andis connected to a pixel circuit arranged in each upper and lower pixel109 facing the through hole 110. In this way, an image signal can benormally output even in the case where the through hole 110 passingthrough the array substrate and the counter substrate is arranged in thedisplay region 103. Furthermore, although a structure is shown in FIG. 3in which the scanning line 141 and the data line 142 do not overlap themoisture blocking region 111, the present invention is not limited tothis structure. A structure is also possible in which the scanning line141 and the data line 142 overlap the moisture blocking region 111. Inaddition, although an example in which one through hole 110 is arrangedthe display region 103 shown in FIG. 3, a plurality of through holes 110may also be arranged. In addition, in the case where a plurality ofthrough holes 110 are arranged, the size of each through hole 110 may bedifferent. Although an example is shown in which the through hole 110and the moisture blocking region 111 are formed in a circular shape,they may also have a polygonal shape.

FIG. 4 shows a cross-sectional view along the line B1-B2 shown in FIG.3. Furthermore, although the width of the through hole 110 is shown tobe narrower than the width of the moisture blocking region 111 for thesake of explanation in the cross-sectional view of FIG. 4, actually thewidth of the through hole 110 is wider than the width of the moistureblocking region 111.

In FIG. 4, a data line 142 bypassing a through hole 110 is arrangedabove the interlayer insulating film 122. The data line 142 is formed inthe same layer as the source electrodes or drain electrodes 117 and 118shown in FIG. 2, for example. A planarization film 123 is arranged abovethe interlayer insulating film 122. In a region PX in which a pixel 109is formed, a protective film 124 is arranged above the planarizationfilm 123. A protective film 124 is contact with an end part theplanarization film 123 (an upper surface and side surface of theplanarization film 123) in the moisture blocking region 111. Theprotective film 124 is preferred to have barrier properties againstmoisture.

As described above, the pixel electrode 125, first insulating layer 126,organic layer 127 and the counter electrode 128 are arranged in theregion PX where a pixel 109 is formed. The pixel electrode 125, theorganic layer 127, and the counter electrode 128 form a light emittingelement 130. A first inorganic insulating layer 131 is arranged abovethe light emitting element 130. In addition, the first inorganicinsulating layer 131 is arranged in contact with the protective film 124above the interlayer insulating film 122. In addition, the firstinorganic insulating layer 131 is arranged in contact with an end partof the protective film 124. The first inorganic insulating layer 131functions as a sealing film of the light emitting element 130.

A dummy pixel D may be arranged between the pixel 109 and the throughhole 110. The dummy pixel D shown in FIG. 4 includes a pixel electrode125, an organic layer 127 and a counter electrode 128. It is notabsolutely necessary that the dummy pixel D have a function for emittinglight and is not required to have the same structure as the pixel 109and the light emitting element 130. For example, by arranging the dummypixel D between the pixel 109 and the through hole 110, in themanufacturing process after the arrangement of the through hole 110, itis possible to obtain an effect of preventing a pixel circuit arrangedin a pixel 109 from being damaged by static electricity the side surfaceof the through hole 110, that is, from the end surface of the arraysubstrate exposed by the through hole 110.

The array substrate having the structure described above and the countersubstrate 102 are bonded together via the filler 135. Furthermore, asshown in FIG. 4, the counter substrate 102 may be arranged with a lightshielding layer 139 on the side facing the light emitting element 130 inthe moisture blocking region 111. A polarization plate 138 is arrangedon the display surface side of the counter substrate 102.

The through hole 110 is a hole which passes through the array substrateand the counter substrate 102. In addition, as shown in FIG. 4, thepolarization plate 138 also has an opening part at a position where thethrough hole 110 is arranged.

When an organic EL element included in the organic EL display device isexposed to air, moisture and oxygen in the air cause deterioration of alight emitting layer including an organic EL material and a cathode, andthus leads to a decrease in the performance of the device. As isdisclosed in Japanese Laid Open Patent Publication No. 2014-235790, inthe case of forming a through hole passing through a display panel,moisture or oxygen enters from a region where the through hole is formedwhich causes an organic EL element to deteriorate leading to a problemwhereby the reliability of the organic EL display device decreases.

As shown in FIG. 4, a structure is adopted in which the moistureblocking region 111 is arranged so as to enclose the through hole 110passing through the array substrate and the counter substrate 102 in thedisplay region 103. In this way, an end part of the planarization film123 and an end part of the first insulating layer 126 which can become apathway for the entrance of moisture or oxygen, can be sealed by theprotective film 124 having a barrier function against moisture andoxygen. In addition, a first inorganic insulating layer 131 (sealingfilm) having barrier properties against moisture and oxygen is arrangedabove the light emitting element 130. By adopting a structure in whichthe first inorganic insulating layer 131 extends up to the moistureblocking region 111, and the protective film 124 and the first inorganicinsulating layer 131 are in contact with each other in the moistureblocking region 111, it is possible to prevent moisture and oxygen fromentering from the through hole 110. In other words, in the moistureblocking region 111, that is, in a region between the through hole 110and a pixel 109, by not arranging a layer formed of an organic materialin a stacked structure in which various layers formed above the firstsubstrate 101 are stacked, it is possible to prevent moisture and oxygenfrom entering from the through hole 110. In this way, it is possible toprevent deterioration of a light emitting element, and therebyreliability of the display device can be improved. In addition, it ispossible to provide a display device with improved design properties byarranging the through hole 110.

An example of a display device partially different from FIG. 4 is shownin FIG. 5. In the display device shown in FIG. 5, the structure of thesealing film arranged above the light emitting element 130 is partiallydifferent from the structure of the sealing film arranged above thelight emitting element 130 shown in FIG. 4. Since the other structuresare the same as those of the display device shown in FIG. 4, a detailedexplanation is omitted.

As shown in FIG. 5, a first inorganic insulating layer 131, organicinsulating layer 132, and a second inorganic insulating layer 133 arearranged above the light emitting element 130. The first inorganicinsulating layer 131, the organic insulating layer 132 and the secondinorganic insulating layer 133 function as a sealing film of the lightemitting element 130. Since it is possible to prevent moisture andoxygen from entering the light emitting element 130 by arranging asealing film above the light emitting element 130, deterioration of thelight emitting element 130 due to moisture or oxygen can be prevented.The organic insulating layer 132 includes an organic resin material. Forexample, a known organic resin material such as polyimide, polyamide,acrylic or epoxy can be used as the organic resin material. In addition,the second inorganic insulating layer 133 is preferably a high densityfilm which can prevent moisture and oxygen from entering. For example,it is preferred to use a silicon nitride film as the second inorganicinsulating layer 133.

As shown in FIG. 5, the organic insulating layer 132 is arranged tocover an end part of the first insulating layer 126 and an end part ofthe planarization film 123 with the first inorganic insulating layer 131interposed therebetween. In addition, the second inorganic insulatinglayer 133 is arranged to cover an upper surface and an end part of theorganic insulating layer 132, and is arranged to contact the firstinorganic insulating layer 131.

As shown in FIG. 5, by arranging the first inorganic insulating layer131, the organic insulating layer 132 and the second inorganicinsulating layer 133 as a sealing film above the light emitting element130, it is possible to prevent moisture and oxygen from entering thelight emitting element 130. In addition, by adopting a structure inwhich the protection film 124 and the first inorganic insulating layer131, and the first inorganic insulating layer 131 and the secondinorganic insulating layer 133 are in contact with each other in themoisture blocking region 111, it is possible to prevent moisture andoxygen from entering the light emitting element 130. In particular, astructure in which the first inorganic insulating layer 131 and thesecond inorganic insulating layer 133 are directly in contact at an endpart of the through hole 110 (region in the moisture blocking region 111in contact with an end part of the through hole 110) without beinginterposed by an organic layer therebetween, has a remarkable effect ofblocking moisture n from entering from the through hole 110 to theinside of the display device 100. In addition, it is possible to providea display device with improved design properties by arranging thethrough hole 110.

An example of a display device partially different from FIG. 5 is shownin FIG. 6. In the display device shown in FIG. 6, the structure of themoisture blocking region 111 is partially different from that of themoisture blocking region 111 shown in FIG. 5. Since the other structuresare the same as those of the display device shown in FIG. 5, a detailedexplanation is omitted.

As shown in FIG. 6, a convex part 143 is arranged above the interlayerinsulating film 122 in the moisture blocking region 111. In a planarview, a plurality of convex parts 143 are arranged along an outerperiphery of the through hole 110. One convex part 143 may be providedannularly along the outer periphery of the through hole 110. Inaddition, the convex part 143 is formed from the same organic insulatingmaterial as the organic insulating material forming the planarizationfilm 123. In addition, a protective film 124 is arranged to cover theplanarization film 123 and the convex part 143. The protective film 124is arranged in contact with an end part of the planarization film 123.In addition, in the convex part 143, a convex part 144 is arranged viathe protective film 124. The convex part 144 is made of the same organicinsulating material as the first insulating layer 126. In addition, theconvex part 144 has a shape conforming to the shape of the convex part143. In addition, the first inorganic insulating layer 131 is arrangedin contact with an end part of the protective film 124. In addition, thefirst inorganic insulating layer 131 is in contact with the uppersurface of the protective film 124 in a region where the convex part 143is not formed. In addition, the first inorganic insulating layer 131 andthe second inorganic insulating layer 133 are arranged to be in contactwith each other in the moisture blocking region 111. Furthermore, astructure is also possible where the convex part 144 is not arranged.

As shown in FIG. 6, by arranging the convex part 143 and the convex part144 in the moisture blocking region 111, it is possible to increase theregion where the first inorganic insulating layer 131 and the secondinorganic insulating layer 133 are in contact with each other. In thisway, moisture and oxygen are further prevented from entering the lightemitting element 130. In addition, by arranging the through hole 110, itis possible to provide a display device with improved design properties.

As shown in FIG. 7, a structure is possible in which a plurality ofconvex parts are arranged in the moisture blocking region 111. That is,in the structure of the convex part shown in FIG. 7, a plurality ofconvex parts 143 are arranged along the outer periphery of the throughhole 110 in a planar view, and furthermore, a plurality of convex parts145 are arranged to surround the plurality of convex parts 143. A convexpart 146 may also be arranged above the convex part 145 similar to thepositional relationship and structure between the convex part 143 andthe convex part 144. One convex part 143 and one convex part 145 may bearranged annularly along the outer periphery of the through hole 110. Byarranging a plurality of convex parts formed from the same material asthe planarization film 123 in the moisture blocking region 111, it ispossible to increase the region where the first inorganic insulatinglayer 131 and the second inorganic insulating layer 133 are in contactwith each other. In this way, moisture and oxygen can be furtherprevented from entering into the light emitting element. In addition, byarranging the through hole 110, it is possible to provide a displaydevice with improved design properties.

[Manufacturing Method 1]

Next, a manufacturing method of the display device 100 is explainedreferring to FIG. 8. FIG. 8 is a process flow for explaining themanufacturing method of the display device 100 according to the presentembodiment. Furthermore, with respect to the process flow shown in FIG.8, the reference numerals in FIG. 2 are used for the explanation of thepixels 109, and the reference numerals in FIG. 6 are used for thethrough hole 110 and moisture blocking region 111.

First, a transistor 120 is formed over a first substrate 101 formed on asupporting substrate (not shown in the diagram) (step S201). In thepresent embodiment, a case is explained where a glass substrate is usedas the supporting substrate and polyimide is used as the first substrate101. Next, an interlayer insulating film 122, a source electrode ordrain electrode 118 connected via an opening of the interlayerinsulating film 122 are formed above the transistor 120. Next, aplanarization film 123 is formed above the interlayer insulating film122 and the source electrode or drain electrode 118. After that, theplanarization film 123 is processed so that an opening part is formed inthe planarization film 123 in a region where the through hole 110 isformed, and a convex part 143 is formed in the moisture blocking region111.

Next, a protective film 124 is formed above the planarization film 123and the convex part 143 (step S202). The protective film 124 is formedto cover an end of the planarization film 123 existing in the moistureblocking region 111 and cover the convex part 143. In addition, it ispreferred that the interlayer insulating film 122 and the protectivefilm 124 contact each other in the moisture blocking region 111.

Next, a light emitting element 130 is formed above the protective film124 (step S203). The light emitting element 130 forms in order a pixelelectrode 125, first insulating layer 126, organic layer 127, and acounter electrode 128. At the same time as forming the first insulatinglayer 126, a convex part 144 is formed above the protective film 124.

Next, a sealing film is formed above the light emitting element 130(step S204). A first inorganic insulating layer 131, an organicinsulating layer 132 and a second inorganic insulating layer 133 areformed in this order as a sealing film.

Next, the first substrate 101 on which the transistor 120 and the lightemitting element 130 are formed and the counter substrate 102 are bondedtogether with a filler 135 interposed therebetween (step S205).

Next, the bonded first substrate 101 and counter substrate 102 are cutaccording to the shape of the display device or to a size larger thanthe shape of the display device (step S206). It is possible to use ascribe break with a scribing wheel, punch cutting, laser cutting andcombinations thereof for the cutting method of step S206.

Next, the support substrate is cut (step S207). It is possible to use ascribe break with a scribing wheel, punch cutting, laser cutting andcombinations thereof for the cutting method of the support substrate.Steps S206 and S207 may also be performed at the same time.

Next, the polarization plate 138 is attached to the counter substrate102 (step S208). After this, a step of mounting a driver IC on the firstsubstrate 101 may be included.

Next, the first substrate 101 is peeled from the support substrate byirradiating the first substrate 101 with a laser through the supportsubstrate (step S209). The order of steps S208 and S209 may also beinterchanged. That is, the polarization plate 138 may be bonded afterpeeling the support substrate.

Next, the second substrate 112 is bonded to the rear surface of thefirst substrate 101 (step S210). In the present embodiment, a case isexplained where polyethylene terephthalate is used as the secondsubstrate 112. Here, the structure from the second substrate 112 to asealing film is called an array substrate. After this, in the case whencutting is performed to a size larger than the shape of the displaydevice in step S206, the periphery of the array substrate and thecounter substrate 102 is cut so as to adjust the exterior shape of thedisplay device.

Next, the through hole 110 is formed in the array substrate and thecounter substrate 102 (step S211). The through hole 110 is formed by amechanical processing method using a punch or the like. In addition, thethrough hole 110 is formed to be located on the interior of the moistureblocking region 111. In this way, it is possible to collectively formthe through hole 110 in the array substrate and the counter substrate.

The display device 100 according to this embodiment can be formed by thesteps described above. According to the manufacturing method shown inFIG. 8, the through hole 110 is arranged in the display region 103 andthereby it is possible to manufacture a display device with improveddesign properties. In addition, even if the through hole 110 is formed,since it is possible to prevent moisture and oxygen from entering fromthe through hole 110 by the moisture blocking region 111, deteriorationof the light emitting element can be prevented. In this way, reliabilityof the display device can be improved. Furthermore, since the sealingfilm is formed using a plasma CVD apparatus arranged with a mask in stepS204 and patterning of the sealing film becomes unnecessary, that it ispossible to simplify the formation process of a sealing film.

[Manufacturing Method 2]

In addition, it is possible to manufacture the display device 100 by theprocess flow shown in FIG. 9. Since the process flow shown in FIG. 9 isonly partly different from the process flow of FIG. 8 after theformation of a sealing film, the processes after the formation of thesealing film are explained in detail and a detailed explanation of theprocesses similar to FIG. 8 is omitted.

In the process flow of FIG. 9, after the sealing film is formed in stepS204, the region where the through hole 110 is to be subsequently formedis etched until the support substrate is exposed, that is, until thefirst substrate 101 which is in direct contact with the supportsubstrate (step S220). The etching process may be dry etching or wetetching. Step S220 may be a step of etching up to the first inorganicinsulating layer 131. In addition, a manufacturing method may beperformed in which a sealing film is not formed in a region where thethrough hole 110 is formed by using a mask when a sealing film is formedinstead of performing step S220. In step S220, an etching process isperformed on the region where the through hole 110 is subsequentlyformed and the first substrate 101 and the sealing film are removed. Inthis way, it is possible to prevent damage to the first substrate 101and the sealing film when forming the through hole 110 in the holeopening step of step S211. The steps after step S205 are the same as theprocess flow of FIG. 8. In this way, it is possible to prevent moistureand oxygen or the like from entering due to damage of the firstsubstrate 101 and the sealing film and prevent moisture and oxygen toentering the light emitting element 130. In this way, a highly reliabledisplay device can be provided.

Second Embodiment

In the present embodiment, an explanation is given of a display devicehaving a partly different structure to the display device explained inthe first embodiment while referring to FIG. 10 to FIG. 14.Specifically, the structure of the moisture blocking region 111 isexplained in detail. Since the other structures are the same as those ofthe display device explained in the first embodiment, a detailedexplanation is omitted.

The moisture blocking region 111 of the display device shown in FIG. 10has a structure partially different from the moisture blocking region111 of the display device shown in FIG. 4. Specifically, in the moistureblocking region 111, the first inorganic insulating layer 131 whichfunctions as a sealing film is formed in contact with an end part of thefirst substrate 101, an end part of the interlayer insulating film 122,and the end part of the protective film 124. By adopting the structureshown in FIG. 10, it is possible to prevent moisture and oxygen fromentering from the end part of the first substrate 101 and the end partof the interlayer insulating film 122 and thereby prevent the lightemitting element 130 from deteriorating.

Next, the moisture blocking region 111 of the display device shown inFIG. 11 has a structure partially different from the moisture blockingregion 111 of the display device shown in FIG. 10. Specifically, in themoisture blocking region 111, the organic insulating layer 132 isarranged above the first inorganic insulating layer 131, and the secondinorganic insulating layer 133 is arranged above the organic insulatinglayer 132. The first inorganic insulating layer 131 is arranged incontact with an end part of the protective film 124, an end part of theinterlayer insulating film 122, and an end part of the first substrate101. In addition, the end part of the organic insulating layer 132 iscovered by the second inorganic insulating layer 133. In addition, thesecond inorganic insulating layer 133 is arranged in contact with thefirst inorganic insulating layer 131 and together with the firstinorganic insulating layer 131 covers the end part of the firstsubstrate 101, the end part of the interlayer insulating film 122, andan end part of the protective film 124. By adopting the structure shownin FIG. 11, the region where the first inorganic insulating layer 131and the second inorganic insulating layer 133 are in contact can beincreased. In addition, it is possible to prevent moisture and oxygenfrom entering from the end part of the first substrate 101 and the endpart of the interlayer insulating film 122, and thereby it is possibleto prevent the light emitting element 130 from deteriorating.

The moisture blocking region 111 of the display device shown in FIG. 12has a structure partially different from the moisture blocking region111 of the display device shown in FIG. 11. Specifically, in themoisture blocking region 111, the organic insulating layer 132 isarranged above the first inorganic insulating layer 131, and the secondinorganic insulating layer 133 is arranged above the organic insulatinglayer 132. Here, a structure is adopted in which an end part of theprotective film 124 is covered by the first inorganic insulating layer131, and an end part of the first inorganic insulating layer 131 iscovered by the second inorganic insulating layer 133. In addition, thesecond inorganic insulating layer 133 is arranged in contact with thefirst inorganic insulating layer 131. In addition, the first inorganicinsulating layer 131 and the second inorganic insulating layer 133 isarranged in contact with an end part of the organic insulating layer132, the end parts of the interlayer insulating film 122, and the endpart of first substrate 101. Moisture and oxygen can be prevented fromentering from the end part of the first substrate 101, the end part ofthe interlayer insulating film 122, the end part of the protective film124 and the end part of the first inorganic insulating layer 131 andthereby the light emitting element 130 can be prevented fromdeteriorating.

Next, the moisture blocking region 111 of the display device shown inFIG. 13 has a structure that is partially different from the moistureblocking region 111 of the display device shown in FIG. 11.Specifically, in the moisture blocking region 111, the organicinsulating layer 132 is arranged above the first inorganic insulatinglayer 131, and the second inorganic insulating layer 133 is arrangedabove the organic insulating layer 132. The first inorganic insulatinglayer 131 is arranged in contact with an end part of the protective film124, an end part of the interlayer insulating film 122 and an end partof the first substrate 101. In addition, although the second inorganicinsulating layer 133 covers an end part of the organic insulating layer132, the end part of the second inorganic insulating layer 133 ispatterned. It is possible to prevent moisture and oxygen from enteringfrom the end part of the first substrate 101, the end part of theinterlayer insulating film 122 and the end part of the protective film124, and thereby it is possible to prevent the light emitting element130 from deteriorating.

Next, the moisture blocking region 111 of the display device shown inFIG. 14 is partially different from the moisture blocking region 111 ofthe display device shown in FIG. 11. Specifically, in the moistureblocking region 111, the organic insulating layer 132 is arranged abovethe first inorganic insulating layer 131, and the second inorganicinsulating layer 133 is arranged above the organic insulating layer 132.In FIG. 14, the second insulating layer 134 covers an end part of thefirst substrate 101, an end part of the interlayer insulating film 122,an end part of the protective film 124, an end part of the firstinorganic insulating layer 131, and an end part of the second inorganicinsulating layer 133. The second insulating layer is preferably formedusing the same material as the first inorganic insulating layer 131 andthe second inorganic insulating layer 133. By arranging the secondinsulating layer 134 to cover the end parts of the plurality ofinsulating layers, it is possible to reinforce the end parts of theplurality of insulating layers. In addition, it is possible to preventmoisture and oxygen from entering from the end parts of the plurality ofinsulating layers and thereby prevent the light emitting element 130from deteriorating.

Furthermore, although an example is shown FIG. 10 to FIG. 14 in whichthe convex part 143 shown in FIG. 6 or the convex part 145 shown in FIG.7 is not arranged in the moisture blocking region 111, the structureshown in FIG. 10 to FIG. 14 may also be arranged with the convex part143 and convex part 145 as appropriate.

[Manufacturing Method 3]

A process flow of the display device shown in FIG. 10 to FIG. 14 isshown in FIG. 15. The process flow shown in FIG. 15 differs from theprocess flow shown in FIG. 9 in the order of formation of the sealingfilm and etching process. A step of forming a sealing film and a step ofetching processing is explained while referring to FIG. 15 and anexplanation of other steps is omitted.

As shown in FIG. 15, after the light emitting element 130 is formed instep S203, an etching process is performed on the interlayer insulatingfilm 122 and the first substrate 101 (step S230). By performing theetching process, the interlayer insulating film 122 and the firstsubstrate 101 are removed in a region where the through hole 110 issubsequently formed.

Next, a first inorganic insulating layer 131 which functions as asealing film is formed (step S204). In this way, an end part of theprotective film 124, an end part of the interlayer insulating film 122,and an end part of the first substrate 101 are formed so as to becovered by the first inorganic insulating layer 131. In this way, it ispossible to obtain the structure of the display device shown in FIG. 10.

In addition, in step S204 in FIG. 15, the end part of the protectivefilm 124, the end part of the interlayer insulating film 122, and theend part of the first substrate 101 are covered by the first inorganicinsulating layer 131. Next, the organic insulating layer 132 is formedabove the first inorganic insulating layer 131 and the second inorganicinsulating layer 133 is formed above the organic insulating layer 132.The second inorganic insulating layer 133 is formed so as to cover anend part of the protective film 124, an end part of the interlayerinsulating film 122, and an end part of the first substrate 101 via thefirst inorganic insulating layer 131. In this way, it is possible toobtain the structure of the display device shown in FIG. 11.

In addition, in step S204 in FIG. 15, after the formation of the firstinorganic insulating layer 131, the first inorganic insulating layer 131is patterned and then the organic insulating layer 132 is formed andthen the second inorganic insulating layer 133 is formed. The secondinorganic insulating layer 133 is formed to cover an end part of thefirst inorganic insulating layer 131, an end part of the protective film124, an end part of the interlayer insulating film 122, and an end partof the first substrate 101. In this way, it is possible to obtain thestructure of the display device shown in FIG. 12.

In addition, in step S204 in FIG. 15, the first inorganic insulatinglayer 131 is formed so as to cover an end part of the protective film124, an end part of the interlayer insulating film 122, and an end partof the first substrate 101. After forming the first inorganic insulatinglayer 131, the organic insulating layer 132 is formed, and the secondinorganic insulating layer 133 is formed above the organic insulatinglayer 132. After this, the second inorganic insulating layer 133 ispatterned. In this way, it is possible to obtain the structure of thedisplay device shown in FIG. 13.

In addition, in step S204 in FIG. 15, the end part of the protectivefilm 124, the end part of the interlayer insulating film 122, and theend part of the first substrate 101 are covered by the first inorganicinsulating layer 131. Next, the organic insulating layer 132 is formedabove the first inorganic insulating layer 131, and the second inorganicinsulating layer 133 is formed above the organic insulating layer 132.The second inorganic insulating layer 133 is formed so as to cover anend part of the protective film 124, an end part of the interlayerinsulating film 122, and an end part of the first substrate 101 via thefirst inorganic insulating layer 131. Furthermore, the second insulatinglayer 134 is formed above the second inorganic insulating layer 133covering an end part of the first substrate 101, an end part of theinterlayer insulating film 122, an end part of the protective film 124,an end part of the first inorganic insulating layer 131, and an end partof the second inorganic insulating layer 133. In this way, it ispossible to obtain the structure of the display device shown in FIG. 14.

Since the steps after the counter substrate bonding step (step S205)shown in FIG. 15 are the same as the steps shown in FIG. 8, a detailedexplanation is omitted.

[Manufacturing Method 4]

A process flow partly different from the process flow shown in FIG. 9 isexplained in FIG. 16. Specifically, the process after step S204 shown inFIG. 16 is different from the process flow shown in FIG. 9.

In the process flow of FIG. 9, after the sealing film is formed in stepS204, the region where the through hole 110 is subsequently formed isetched until the support substrate is exposed, that is, up to the firstsubstrate 101 which is in direct contact with the support substrate(step S240). The etching treatment may be dry etching or wet etching. Instep S240, an etching process is performed on the region where thethrough hole 110 is subsequently formed to remove the first substrate101 and the sealing film.

Next, the first substrate 101 on which the transistor 120 and the lightemitting element 130 are formed is bonded to the counter substrate 102via the filler 135 (step S250). In this step, a substrate having a holeis used as the counter substrate 102 in a region where the through hole110 is to be subsequently formed.

Next, the bonded first substrate 101 and counter substrate 102 are cutaccording to the shape of the display device or to a size larger thanthe shape of the display device (step S206). Scribing and breaking witha scribing wheel, punching cutting, laser cutting, and combinationsthereof can be used as a method of cutting the first substrate 101.

Next, the support substrate is cut (step S207). Scribing and breakingwith a scribing wheel, punching cutting, laser cutting, and combinationsthereof can be used as a cutting method of the supporting substrate.

Next, the polarization plate 138 is bonded to the counter substrate 102(step S260). Also in this step, a polarization plate having a hole isused in a region where the through hole 110 is subsequently formed asthe polarization plate 138. After this, a step of mounting a driver ICon the first substrate 101 may be included.

Next, the first substrate 101 is peeled from the support substrate byirradiating the first substrate 101 with a laser through the supportsubstrate (step S209).

Next, the second substrate 112 is bonded to the rear surface of thefirst substrate 101 (step S270). Also in this step, a substrate having ahole is used in a region where the through hole 110 is arranged as thesecond substrate 112. After this, in the case when cutting is performedat a size larger than the shape of the display device in step S206, theperiphery of the array substrate and the counter substrate 102 is cut soas to adjust the outer shape of the display device.

A display device can be manufactured by the steps described above. Inthe process flow shown in FIG. 16, the counter substrate 102, secondsubstrate 112 and polarization plate 138 having holes are used in aregion where the through hole 110 is arranged. In this way, it ispossible to omit the step of forming through holes by a mechanicalprocessing method on the array substrate and the counter substrate 102.In addition, it is possible to prevent damage to the first substrate 101and the sealing film and the like by forming a through hole by amechanical processing method. In this way, it is possible to preventmoisture and oxygen or the like from entering from the damage to thefirst substrate 101 and the sealing film and prevent moisture and oxygenor the like entering the light emitting element 130. In this way, ahighly reliable display device can be provided.

First Example

Examples of the display device according to the present invention areexplained while referring to FIG. 17 and FIG. 18. In the display device200 shown in FIG. 17, a plurality of through holes 110 are arranged inthe display region 103. In FIG. 17, six through holes 110 are arrangedvertically. In addition, the display device 200 has a display region103, a driver IC 106, a terminal 107, and a flexible printed circuit 108above the first substrate 101 as an array substrate. In addition, alight shielding layer 139 is arranged on the counter substrate 102 onthe side facing the array substrate. The array substrate and the countersubstrate 102 are bonded to each other with a filler interposedtherebetween. Furthermore, in the array substrate, a scanning linedriving circuit or the like may be formed in a region overlapping withthe light shielding layer 139 of the counter substrate 102.

In the display device 200, six through holes 110 are arranged passingthrough the array substrate and the counter substrate 102, and amoisture blocking region 111 is arranged in a region surrounding thethrough hole 110. By arranging the moisture blocking region 111 in theregion surrounding the through hole 110, it is possible to preventmoisture and oxygen from entering from the through hole 110. In thisway, it is possible to prevent moisture and oxygen from entering intothe light emitting element formed in the display region 103, therebydeterioration of the light emitting element can be prevented. As aresult, reliability of the display device can be improved.

A case where the display device 200 is applied as a refill of a notebookis shown in FIG. 18. As shown in FIG. 18, by arranging six through holes110 passing through the array substrate and the counter substrate 102 inthe display device 200, it is possible to pass the through hole 110through a metal part 151 of the notebook. In addition, by arranging themoisture blocking region 111 in the region surrounding the through hole110, it is possible to prevent moisture and oxygen from entering fromthe through hole 110. For example, in the case when the diameter of thethrough hole 110 is 7000 μm, the width of the moisture blocking region111 (the length from the end of the through hole 110 to the region wherea pixel is formed) is 1200 μm. In this case, the non-display width inthe display region 103 is 9400 μm. As shown in the present example,according to the present invention, it is possible to provide a displaydevice with a high level of freedom in appearance design.

Second Example

An example of the display device according to the present invention isexplained while referring to FIG. 19 and FIG. 20. In the display device300 shown in FIG. 19, three through holes 110 are arranged in thedisplay region 103. In addition, the display device 300 has a displayregion 103, a driver IC 106, a terminal 107, and a flexible printedcircuit 108 above the first substrate 101 as an array substrate. Inaddition, a light shielding layer 139 is arranged in the countersubstrate 102 on the side facing the array substrate. The arraysubstrate and the counter substrate 102 are bonded to each other with afiller interposed therebetween. Furthermore, in the array substrate, ascanning line driving circuit or the like may be formed in a regionoverlapping with the light shielding layer 139 of the counter substrate102.

In the display device 300 shown in FIG. 19, three through holes arearranged in the display region 103. The diameters of the through hole152, the through hole 153, and the through hole 154 are different fromeach other. Each of the through holes 152, 153, and 154 is surrounded byeach moisture blocking region 155, 156, and 157. In addition, the widthof the moisture blocking region (the length from the end of the throughhole to the region where a pixel is formed) can be appropriately setaccording to the diameter of the through hole. By providing the moistureblocking regions 155, 156, and 157 in the region surrounding the throughholes 152, 153, and 154, it is possible to prevent moisture and oxygenfrom entering from the through holes 152, 153, and 154. In this way, itis possible to prevent moisture and oxygen from entering into the lightemitting element formed in the display region 103, thereby deteriorationof the light emitting element can be prevented. As a result, reliabilityof the display device can be improved.

A case where the display device 300 is applied to a smartphone is shownin FIG. 20. In the display device 300, an illuminance sensor can befitted in the through hole 152, and a camera, for example, can be fittedin the through hole 153. In addition, a home button can be arranged inthe through hole 154. In the case of fitting an illuminance sensor inthe through hole 152, the diameter of the through hole 152 is set to3000 μm and the moisture blocking region 155 is set to 800 μm. In thiscase, the non-display width in the display area is 4600 μm. In the caseof fitting a camera in the through hole 153, the diameter of the throughhole 153 is set to 4000 μm, and the moisture blocking region 156 is setto 900 μm. In this case, the non-display width in the display area is5800 μm. In the case when a home button is arranged in the through hole153, the diameter of the through hole 154 is set to 10000 μm and themoisture blocking region 157 is set to 1550 μm. In this case, thenon-display width in the display area is 13100 μm.

A person skilled in the art could appropriately add, delete or changedesign elements on the basis of the display device explained asembodiments and examples of the present invention, or those in whichaddition, omission, or changes in conditions of the processes are alsoincluded in the scope of the present invention as long as they do notdepart from the concept of the present invention. In addition, each ofthe embodiments described above can be combined with each other within arange where no technical contradiction occurs.

In addition, even if other actions and effects different from theactions and effects brought about by modes of the embodiments describedabove are obvious from the description of the present specification orthose which can be easily predicted by a person skilled in the art, theyare naturally to be interpreted as belonging to the present invention.

What is claimed:
 1. A display device comprising: a substrate; aplurality of pixels above the substrate, each of the pixels including alight emitting element; a display region including the plurality ofpixels; a thin film transistor which each of the plurality of pixelsincludes; a protective film including a first inorganic insulatingmaterial and located between the thin film transistor and the lightemitting element; a sealing film including a second inorganic insulatingmaterial and covering the light emitting element; and at least onethrough hole located in the display region and passing through thesubstrate, the protective film, and the sealing film, wherein the secondinorganic insulating material is in direct contact with the protectivefilm in a first region located between the through hole and the pixels.